Capex cycle
Coherent’s capex cycle through FY2026–FY2028 is the operational expression of its AI-photonics thesis. Sherman, TX is the load-bearing capacity site — the world’s first 6-inch InP wafer fab and the source of Coherent’s structural cost advantage in EML production. Capex has accelerated from ~7% of revenue in FY2024 to ~9% in FY2026 H1, with management guidance of continued sequential increases through FY2026 to support Datacenter & Communications capacity expansion. The DENSO + Mitsubishi $1B SiC JV (Dec 2023) restructured the SiC capex burden — the Silicon Carbide LLC subsidiary funds its own capex from internal cash flow, lifting the SiC build out of Coherent’s parent-level capex envelope.
Capex trajectory
| Period | Capex ($M) | % of revenue | Cumulative ($M) |
|---|---|---|---|
| FY2023 | ~$330 | ~6.7% | $330 |
| FY2024 | ~$340 | ~7.2% | $670 |
| FY2025 | $440.8 | 7.6% | $1,111 |
| H1 FY2026 | $257.5 | 7.9% | $1,368 |
| Q2 FY2026 alone | $154 | 9.1% | n/a |
| FY2026 (forecast) | $550–650 | ~9–10% | $1,660–1,760 |
| FY2027 (forecast) | $700–900 | ~10–12% | $2,360–2,660 |
| FY2028 (forecast) | $700–900 | ~10–11% | $3,060–3,560 |
Source: FY2025 results ✓; Q1 + Q2 FY2026 releases ✓; FY2027–28 projections are derived from management capex commentary on capacity-build acceleration.
The capex acceleration is consistent with management framing on Q2 FY2026: “support rapid capacity expansion in datacenter and communications” with sequential capex increases planned (Q2 FY2026 release) ✓.
Sherman TX 6-inch InP fab capacity expansion — load-bearing
Coherent announced in March 2024 the world’s first 6-inch InP scalable wafer fabs, located at Sherman TX and Järfälla Sweden (Coherent press release) ✓. Key parameters:
| Metric | Value |
|---|---|
| Wafer-size advantage | 4× more chips per wafer vs 3-inch; ~2.5× more vs 4-inch |
| Die-cost reduction | ~60% vs 3-inch (Coherent disclosure) |
| Sherman TX capex | Multi-hundred-million-dollar multi-year build |
| Texas Semiconductor Innovation Fund grant | $14,076,031 awarded Feb 2026; project total >$154M (Semiconductor Today Feb 9, 2026) ◐ |
| 6-inch ramp progress (Q1 FY2026) | ~80% of target wafer-start rate |
| Internal InP capacity doubling | Targeted Q4 CY2026 |
| Products on 6-inch | 200G EML, DFB-MZ, 100G EML, photodetectors, high-power CW lasers |
The Sherman fab build is the single largest operational capex commitment in Coherent’s near-term horizon. The 6-inch ramp is ahead of plan — at ~80% target wafer-start rate as of Q1 FY2026 commentary, with the doubling target anchored at Q4 CY2026.
SiC substrate capacity — JV-funded structure
Per the December 2023 transaction with DENSO and Mitsubishi Electric (Coherent press release) ✓:
- DENSO + Mitsubishi each invested $500M for 12.5% non-controlling interest = $1.0B total at JV-level
- Coherent retained 75% ownership in Silicon Carbide LLC
- All operating and capital expenses of the Business will be funded by the Business
Translation: SiC capex no longer rolls up to Coherent’s parent capex line. The SiC subsidiary funds its own 200 mm wafer capacity expansion from JV-level cash, with the JV partners contributing growth capital as needed. This reduces Coherent’s parent-level capex burden by approximately $100–200M annually vs the pre-2023 structure.
200G/lane EML ramp + 1.6T module capacity
Capacity-build for 200G/lane EML production is the most strategically-leveraged piece of the capex envelope:
| Capacity action | Timing | Capex bucket | Strategic role |
|---|---|---|---|
| 6-inch InP wafer-fab ramp Sherman TX | CY2025–2026 | Sherman TX fab capex ($hundreds of millions) | Source-laser supply for 1.6T pluggables + CPO |
| 200G EML production ramp on 6-inch | CY2026 | Embedded in fab capex | Capacity for AI-cycle demand |
| 1.6T module assembly capacity | Allen TX + Sherman TX assembly | $50–100M annually | Module-form-factor flexibility |
| VCSEL 200G ramp | 2H CY2026 | Sherman TX existing line | Short-reach 1.6T option |
| Silicon-photonics scaling | OFC 2026 demos; production timeline confidential | $50–100M annually | CPO-engine optionality |
| CPO module assembly | CY2027–2028 | TBD | Vertical-integration into CPO |
The aggregate incremental capex through FY2028 is on the order of $2–3B vs FY2024 baseline (cumulative). The NVDA $2.0B equity injection plus the multi-billion-dollar purchase commitment underwrites the demand-side of this capex envelope — the ROI math depends on capacity utilization at NVDA-anchor demand levels through FY2028.
CHIPS Act / federal-incentive uplift
Coherent benefits from US-domestic-fab incentives:
| Program | Estimated benefit |
|---|---|
| CHIPS Act 25% Investment Tax Credit (ITC) | ~25% of qualifying US fab capex; on Sherman TX 6-inch InP fab build, this translates to potentially $50–100M+ of credits |
| Texas Semiconductor Innovation Fund grant | $14,076,031 cash (Feb 2026) ◐ |
| CHIPS Act direct manufacturing grants | Coherent applied; specific awards confidential ⚠ |
| DOE / DOD photonics R&D grants | Various smaller awards ⚠ |
The 25% federal ITC effectively reduces net Sherman TX capex by ~25% on qualifying spend — a material economic uplift for the fab investment math. This is one factor making the 6-inch InP capacity build economically attractive even at the high upfront capital intensity.
Capacity utilization and ROI math
The capex-ROI argument depends on:
- Capacity utilization at NVDA-anchor demand — NVDA’s multi-billion-dollar purchase commitment underwrites a meaningful share of capacity dedicated to NVDA. The remainder must be filled by other hyperscaler / module-vendor demand.
- ASP discipline holding — supply-tightness pricing supports above-historical gross margins on EML chips and 1.6T modules.
- 6-inch cost advantage realized at scale — the 60% die-cost reduction from 3-inch to 6-inch is a learning-curve outcome, not a starting-yield outcome. Cumulative wafer starts drive the realization of cost savings.
- CPO transition timing — the same fab capacity supports CPO source lasers in 2027–2028, meaning the capex is dual-purpose (pluggable + CPO) rather than single-architecture.
Under the base case (capacity utilization 80%+ through FY2028), the capex envelope supports gross margins in the 38–42% range and operating margins of 19–22%. Under the bear case (NVDA capex digestion + capacity overhang), gross margin compression to 33–35% would compress returns materially.
Capex sensitivity scenarios
| Scenario | FY2026–28 cumulative capex ($B) | Capacity utilization | Margin profile | NPV impact |
|---|---|---|---|---|
| Bull | $2.5–3.0 | 90%+ | GM 40–43% | Positive — 6-inch advantage compounds |
| Base | $2.0–2.5 | 80–85% | GM 38–40% | Neutral — capex returns ~hurdle rate |
| Bear | $1.5–2.0 (under-build) | <80% (over-build) | GM 32–36% | Negative — capacity stranded if AI-capex digests |
The bear case requires NVDA demand to digest below committed-volume levels — which would require NVDA to renegotiate the multi-billion-dollar purchase commitment. As of April 2026, no such signal has emerged. The bull case requires hyperscaler-non-NVDA demand to fill the residual capacity at attractive ASPs.
Cross-link
- Quarterly trend
- Margins and pricing
- Balance sheet — capex-funded by post-NVDA cash position
- 04_market AI capex cycle — demand context
- 04_market InP EML duopoly — capacity-build timing
- 04_market regulatory landscape — CHIPS Act ITC detail
- 02_technology InP EML process
- LITE — capex cycle — duopoly-partner capacity comparison
Sources
- Coherent 6-inch InP wafer-fab press release Mar 2024 ✓
- Coherent Q2 FY2026 press release Feb 4, 2026 ✓
- Coherent Q1 FY2026 press release Nov 5, 2025 ✓
- Texas Semiconductor Innovation Fund grant — Semiconductor Today Feb 9, 2026 ◐
- Coherent SiC $1B JV with DENSO + Mitsubishi Dec 4, 2023 ✓
- Coherent FY2025 annual report ✓
- Q1 FY2026 transcript via Motley Fool ◐